LoeschPack at interpack 2020

Loesch Verpackungstechnik will be attending interpack 2020 in Düsseldorf with a wide range of new machines. In Düsseldorf at the leading industry fair, the Franconian machinery engineering company will be presenting the world première of its RCB-HS for packaging small chocolate products. LoeschPack will also be showing the new LOOP-GB gondola storage system and the FCB high-performance platform for packaging chocolate, biscuits and chewing gum. Completing this system is the new CMT high-performance cartoning machine. The system supplier is also presenting new developments relating to Industry 4.0 and the Internet of Things.

 

Date: May 2020

Location: Düsseldorf, Germany

Fairground: Messe Düsseldorf

 

 

To the interpack 2017 press release

To the interpack 2017 invitation

To the official website of interpack